Research & Development
Allresist is located at the interface between industry and research….
Driven by the ambivalence of routine standard production and specific customer fulfilment, we developed an exceptional competence which is beneficial for all our customers. In addition to this, we conduct long-term research projects with our cooperation partners since the Allresist was founded. Meanwhile, we have successfully finished 12 research projects, all of them leading to new product developments.
We furthermore carry out a variety of small FuE-projects according to our customer’s specific requirements. These projects result in tailored resists, custom made products, and experimental samples.
Completed scientific projects of the Allresist GmbH
2013 – 2014
Project „VEGAS – Methods and equipment for electronic printable cards with safety attributes, development functional structure resists”
Main cooperation partner: Firma Lüth & Dümchen, Berlin; Technische Universität Berlin; FhG Institut für angewandte Polymerforschung. The targets are smartcards with visual ascertainable information by using of special photoresists.
2012 – 2014
Project „INNOPEP – Covering of innovation success in product development and production”
Main cooperation partner: InMediasP GmbH, Hennigsdorf, ASG Luftfahrttechnik und Sensorik GmbH, Weinheim, BEAR Mühlen & Behälter GmbH, Berlin, Berliner Glas KGaA, Berlin, Fraunhofer-Institut für Produktionsanlagen und Konstruktionstechnik (IPK), Berlin, INPRO mbH, Berlin, MaTec Gummiwerk GmbH, Schwielowsee, Pumacy Technologies AG, Bernburg, TU Berlin, Universität Augsburg, CEPRA. Target: Development of application scenarios, assessment, validation, introduction and distribution
2013
Innovation voucher: „Development and synthesis of tailor made electric conductive polymers as resist component for the mask production in the nanometer range”
Main cooperation partner: Institut für Dünnschichttechnologie und Mikrosensorik, Teltow. Target: Electric conductive resist layer fort he e-beam lithography
2012
Innovation voucher: „Synthesis of structure optimized copolymers for the application in innovative e-beamresists”
Main cooperation partner: Institut für Dünnschichttechnologie und Mikrosensorik, Teltow. Target: Alternative to the ZEP-resist – development oft he CSAR 62
2011
Innovation voucher: „Development and synthesis tailor made Bisazide for innovating photoresists for laser direct exposures > 400 nm wavelength”
Main cooperation partner: Institut für Dünnschichttechnologie und Mikrosensorik, Teltow. Target: Innovative photoresists for laser direct exposures > 400 nm wavelength
2009 – 2011
Project: „Development of cross linked Epoxystyrene for OLED- OFET- and Microstructur-Applications“
Cooperation partner: Fraunhofer Institut für Angewandte Polymerforschung, Golm
2006 – 2008
Project: „Development of a simplified procedure for the patterning of silicon and silicon oxide, respectively, using wet-chemical methods“
Cooperation partner: Institute for Thin Film and Microsensoric Technology e.V.
Aim: Resist systems for hydrofluoric acid- and KOH-etching in glass and silicon, respectively.
2006 – 2008
Project: “Nano-structures using lift-off-techniques“
Cooperation partner: Physical Institute, Bavarian Julius-Maximilians-University, Würzburg
Aim: Sub-50-nm-structures using lift-off-techniques
2004 – 2006
Project: “Resists for the LIGA and microsystem technology“
Cooperation partner: Bessy GmbH, Berlin
Aim: Resist structures with a film size of up to 500 µm
2004 – 2006
Project: “Resists for OLED photo patterning”
Cooperation partner: FhG Institute for Applied Polymer Research, Golm
Aim: Patterning of OLEDs
2002 – 2004
Project: “Characterisation and production of functional films allowing orientation“
Cooperation partner: Institute for Thin Film and Microsensoric Technology e.V.
Aim: Orientation films for displays
2001 – 2004
Project: “Negative resist for MST“
Main cooperation partner: Bessy GmbH and CiS Erfurt
Aim: Negative resists for the microsystem technology
2001 – 2002
Project: “Photoresists for special applications in micro patterning“
Main cooperation partner: CiS, Centre for Intelligent Sensors, Erfurt
Aim: Thick photoresist films for the microsystem technology
2000 – 2002
Project: “Thermo-stable resists“
Main cooperation partner: Institute for Thin Film and Microsensoric Technology e.V.
Aim: Thermostable protective coatings for microelectronic applications
1999-2000
Project: “Photo-polymerizable passive coating for screen printing“
ain cooperation partner: Fraunhofer Institute Reliability and Microintegration, Teltow
Aim: Photo-polymerizable passive coating for high precision resistors
1998 – 1999
Project: “Electron beam analogue resist“
Main cooperation partner: University of Joensuu, Finland
Aim: Manufacturing of three-dimensional resist structures for diffractive optics
1997 – 1999
Project: “Activated photoresists for the additive forming of strip conductors“
Main cooperation partner: TU Dresden, Institute for Microsystem Technology
Aim: Manufacturing of flexible strip conductors via electro-plating of resist structures
1995 – 1998
Project: “Resists for eximer laser“
Main cooperation partner: CiS Erfurt
Aim: Resists for eimer laser
1995 – 1996
Project: “Mask resists“
Main cooperation partner: robotron Meiningen GmbH, Advanced Mask Technology Centre Dresden GmbH
Aim: New resist for the production of masks
1995 – 1996
Project: “Resist materials for the nanolithography“
Main cooperation partner: Institute for Thin Film and Microsensoric Technology e.V.
Aim: Defect-free layers of resist materials for nano-structures
1994 – 1996
Project: “Multiprocessing resist“
Main cooperation partner: Institute for Semiconductor Physics, Frankfurt/O.
Aim: Resist for mix & match technology e-beam / photolithography
1993 – 1994
Taking-over of the project “Elster“ from the “Fotochemische Werke“
Main cooperation partner: Institute for Semiconductor Physics, Frankfurt/O.
Aim: Dry-developing e-beam resist
