53rd Issue of the AR NEWS
April 2026
Welcome to the 53rd issue of the AR NEWS. Once again, we would like to inform you about the further development of our company and the current research projects.
Content
- Allresist at the EIPBN (USA), MNE (Switzerland) and SEMICON Europa conferences
- The established HSQ resist Medusa 84 SiH
- Phoenix 81 also available as a PPA liquid resist for the NanoFrazor
- Environmentally friendly alternatives to TMAH- and NEP-based process chemicals
- Allresist expands and starts construction of building extension in May
Allresist is growing — technologically, internationally, and sustainably.
The 53rd issue of AR NEWS highlights exciting product developments, international conference appearances, and the next major step in the company’s expansion. In 2026, Allresist will be present at EIPBN in Denver, MNE in Interlaken, and SEMICON Europa in Munich, showcasing innovative solutions for e-beam and photolithography applications.
A key focus is Medusa 84 SiH, the established HSQ resist known for its outstanding resolution, high etch stability, and impressive storage stability. Phoenix 81 is also entering a new stage: the PPA resist is now available as a ready-to-use liquid resist for NanoFrazor applications. At the same time, Allresist is actively developing more environmentally friendly alternatives to TMAH- and NEP-based process chemicals.
Another major highlight: Due to increasing demand, Allresist will begin construction of its new logistics and shipping extension in May — an important step toward greater production capacity and future growth.
