Information on:
- Polymere resists (layer builder)
- Photosensitive components
- Cross linker
- Other resist components (adhesion promoter, tenside, solvent, colorant)
- Process information such as: Cleaning of substrates, adhesive strength, dilution of resists, yellow light, softbake, rehydration, exposure and storage
- Process procedures such as: Lift-off procedures, wet-chemical etching, dry-chemical etching, UV-curing, lithographic procedures and stabilization/curing of resist layers
See Photo resists: General
Overview E-beam Other Resists