Resist of the month October 2013: Thermally stable negative resist SX AR-N 4340/6 Our last resist of the month was the thermally stable two-layer system SX AR-N 4340/10 – AR-P 5460 which reliably tolerates temperatures of up to 200 °C.
Resist of the month July 2013: Thermally stable two-layer system – SX AR-N 4340/10 – AR-P 5460 In a large variety of lift-off applications, the resist layer is exposed to high thermal loads.
Resist of the month April 2013: Positive e-beam resist CSAR 62 – an alternative to ZEP 520 Users cherish the specific properties of ZEP 520, while service and prices are rather feared.
Resist of the month January 2013: Negative p hotoresists SX AR-N 4340/8 – a resist for laser interference lithography (LIL) Well-ordered structures across an entire wafer can be produced (see image 3)
Resist of the month October 2012: Negative photoresists AR-N 4400 – with optimized bake regime For the new project VEGAS (see AR NEWS, 25 th issue, October 2012), columnar resist structures with a thickness of 10 to up to 60 µm are required.