High-resolution negative e-beam resist AR-N 7520.17new for etching application

Very even and smooth 300nm ridges could be achieved with AR- 7520.17new and a coating thickness of 400nm.

Medusa 82 for EUV applications

For an optimum handling of EUV lithography using the RWTH system, a sensitivity range of 30-40 mJ/cm² is desired. A Medusa 82 sample supplemented with 2.5 % photoacid generator (PAG) already reached this target range. These investigations will be continued within the scope of a research project.

Medusa 82: Influence of post exposure bake (PEB)

The addition of photoacid generators (PAGs) can significantly increase the sensitivity of Medusa 82 (see Resist Wiki “Medusa with photoacid generator”). Another option is to add a PEB after e-beam exposure. Even if substrates were previously stored for several days, the sensitivity significantly increases depending on the temperature and the duration of the PEB.

Medusa 82 with photoacid generator (PAG)

One disadvantage of HSQ and Medusa 82 is the comparably low sensitivity, which can however be increased by an addition of photoacid generators.

Medusa 82 – the alternative to HSQ-resists, storage stability

Our research team successfully developed a negative resist with high resolution and plasma etching stability in oxygen: Medusa 82. Already with the first samples, it was possible to achieve the properties of HSQ.

Utilising Electra 92 for SEM applications

The coating with Electra 92 on highly electrically insulating polymers or also on glass allowed a high-quality imaging of nanostructures in SEM.

Chemically amplified, highly sensitive negative e-beam resist SX AR-N 7730/37

With SX AR-N 7730/37, we present a new negative CAR e-beam resist. This resist possesses a very high sensitivity with at the same time high process stability.

Ratio resolution and dose, exemplarily shown for e-beam resist SX AR-N 7530/1

Process-stable negative resist systems which allow resolutions of < 30 nm with sufficiently high sensitivity are of growing interest for applications in electron beam lithography.

AR-N 7700, 4 µm thick, proximity effect

The general aim of electron beam lithography is to achieve a maximum resolution, and therefore mostly very thin layers are used (50 – 500 nm). In a few cases however also very small structures with high aspect ratio are of interest.

Diffractive optics with the “analogous“ e-beam resist

Allresist designed an e-beam resist which produces, depending on the respective exposure dose used, a three-dimensional resist profile.