Bottom resist AR-BR 5460 has already been used for a decade in combination with positive (e.g. AR-P 3510) or negative resists (e.g. AR-N 4340) for a large variety of lift-off applications.
Structures of the temperature-stable negative resist SX AR-N 4340/6 are able to withstand temperatures of up to 350 °C with high shape accuracy
In addition to a structuring with photomasks which is frequently used in lithography, is it also possible to write the structures directly, i.e. without masks, with laser beams.
Resist AR-P 5900/4 is already well established on the market for many years. Structures of this positive resist are characterized by a considerably higher alkaline stability as compared to standard positive resists (e.g. AR-P 3510 or AZ resists).
In the CiS Institute for Microsensors, deep silicon etch grooves are structured for the fabrication of customer-specific components. For this purpose, a coating procedure via spray coating was developed.
Teflon or similar products are, due to their extreme surface properties, utilised for applications in which a structuring of the Teflon is sometimes desirable. The hydrophobic surface properties however impede the coating with resist,
Spray resists available to date (AZ 4999) are designed for extreme topologies, which means that even vertical silicon trench sidewalls can be covered with resist. These excellent features however come at a price:
General exposure wavelengths for broadband UV-lithography are in a range between 300 nm and 450 nm, which includes the important lines of high-pressure mercury lamp at 436 nm (g-line).