In addition to the established adhesion promoter AR 300-80 (which is based on diphenylsilanediol), also other silicone-containing compounds may be used to render hydrophilic surfaces more hydrophobic.
In order to prevent the above described stripping of the PMMA layer from the wafer, the use of adhesion promoters is strongly recommended. Helpful is also a tempering of the wafers at maximum temperature (if possible > 200°C)
The adhesion of resists to different substrates varies. Many substrates like e.g. silicon, silicon nitride and base metals (like aluminium, copper) show generally good resist adhesion features,