New AR 300-80 and contact angle measurement

In addition to the established adhesion promoter AR 300-80 (which is based on diphenylsilanediol), also other silicone-containing compounds may be used to render hydrophilic surfaces more hydrophobic.

Adhesive strength of AR 300-80

In order to prevent the above described stripping of the PMMA layer from the wafer, the use of adhesion promoters is strongly recommended. Helpful is also a tempering of the wafers at maximum temperature (if possible > 200°C)

Adhesion promoter HMDS and diphenylsilanedio (AR 300-80)

The adhesion of resists to different substrates varies. Many substrates like e.g. silicon, silicon nitride and base metals (like aluminium, copper) show generally good resist adhesion features,