Chemically enhanced negative resist without cross-linking

In some applications, the substrate on which the negative resist is to be applied cannot be heated. This may be the case for sensitive glass and especially for very big substrates.

Chemically enhanced negative resist (Process parameters and resolution)

Process parameters, sensitivity, resolution, edge quality and dimensional stability are exemplarily shown for AR-N 4340. Investigations were performed on 150mm-wafers with Si-surface.

Resist of the month July 2013: Thermally stable two-layer system – SX AR-N 4340/10 – AR-P 5460

Resist of the month July 2013: Thermally stable two-layer system – SX AR-N 4340/10 – AR-P 5460 In a large variety of lift-off applications, the resist layer is exposed to high thermal loads.

Aluminium structures developed directly

The fabrication of aluminium structures generally involves the production of a resist mask with subsequent wet-chemical etching. The more elegant procedure of direct development can be applied if the negative resist SX AR-