Chemically enhanced negative resist (Process parameters and resolution)

Process parameters, sensitivity, resolution, edge quality and dimensional stability are exemplarily shown for AR-N 4340. Investigations were performed on 150mm-wafers with Si-surface.

Resist of the month July 2013: Thermally stable two-layer system – SX AR-N 4340/10 – AR-P 5460

Resist of the month July 2013: Thermally stable two-layer system – SX AR-N 4340/10 – AR-P 5460 In a large variety of lift-off applications, the resist layer is exposed to high thermal loads.

Aluminium structures developed directly

The fabrication of aluminium structures generally involves the production of a resist mask with subsequent wet-chemical etching. The more elegant procedure of direct development can be applied if the negative resist SX AR-