With respect to the raw materials used, photoresists fall into two different categories:
- PMMA resists (protective coating AR-PC 5000/4, -19, -30, and SX AR-N 4800)
- SX AR-PC 5000/40
- Novolac resists (AR-P 3000, AR-N/U 4000, a few 5000)
The general rule is that with increasing bake or process temperature, the solubility of the resist films decreases. This is reflected by gradually increasing removal problems.
Easily soluble in: acetone, MEK, PMA (PGMEA), chlorobenzene, ethylbenzene, anisole, MIBK
Particular in: NMP, ethyl lactate
Not soluble in: water, isopropanol, ethanol, nonane, and the like.
SX AR-PC 5000/40
Well soluble in: chlorobenzene, ethylbenzene
Not soluble in: anisole, MIBK, ethyl lactate, and the like.
Well soluble in: acetone, MEK, PMA (PGMEA), anisole, MIBK, butyl acetate
Particular in: isopropanol, NMP, ethanol, ethyl lactate
Not soluble in: water, chlorobenzene, ethylbenzene, nonane, and the like.
Abbreviations of solvents and raw materials used: MEK: methyl ethyl ketone; PMA (= PGMEA): 1-methoxy-2-propyl acetate, NMP: N-methyl-2-pyrrolidone, MIBK: methyl isobutyl ketone, TMAH: tetra methyl ammonium hydroxide, KOH: caustic potash solution, HF: hydrofluoric acid