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AR-N 2200 series

Products on demand

(AR-N 2210, AR-N 2220)

Ready-to-use negative spray resists for various applications

Characterisation

  • broadband UV, i-line, g-line
  • AR-N 2210 for a uniform coverage of vertical trenches
  • AR-N 2220 for etch profiles with 54° slopes
  • good adhesion, smooth surface
  • combination of novolac and naphthoquinone diazide
  • safer solvent PGMEA as well as methyl ethyl ketone

Interesting Resist Wiki articles

Properties

  • Film thickness:                       4-10 µm
  • Resolution:                              1.0 µm
  • Contrast:                                   3
  • Flash point:                              12 °C
  • Storage temperature:             10-18 °C

* The products have a guaranteed shelf life of 6 months from the date of sale when stored according to instructions and can be used beyond that without guarantee until the label date.

Available order sizes

  • Product on request

Please contact us for further requests.

Suitable process chemicals

Adhesion Promoter AR 300-80 new

For improving the adhesive strength of photo and e-beam resists

Developer AR 300-44

For the development of photoresists and novolac-based e-beam resist films

Remover AR 600-71

For the stripping of tempered photoresist and e-beam resist films

Structure resolution

AR-N 2210: Film thickness 5 μm, Resolution up to 1.4 μm

Process parameters

  • Substrate
    Si 6“ Wafer
  • Tempering
    82 °C, Chuck
  • Exposure
    Breitband (h-, g-, i-line)
  • Development
    AR 300-44, 4 min Puddle

Resist structures

AR-N 2220: 5 μm resist structures in 150 μm deep etch grooves

Science poster

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