Photoresist AR-N 2210
Ready-to-use positive and negative spray resists for various applications
Please contact us for further requests.
Characterisation
- broadband UV, i-line, g-line
- negative resists for a uniform coverage of vertical trenches
- good adhesion, smooth surface
- combination of novolac and naphthoquinone diazide
- safer solvent PGMEA as well as methyl ethyl ketone
Interesting Resist Wiki articles
Properties
- Film thickness (μm)4-10 µm
- Resolution (μm)1,0 µm
- Contrast3,0
- Flash point (°C)1 °C
- Storage 6 month (°C)10-18 °C
Available order sizes
- Product on request
Structure resolution
Film thickness 5 μm Resolution up to 1.4 μm
Process parameters
- SubstrateSi 6“ Wafer
- Tempering82 °C, Chuck
- ExposureBreitband (h-, g-, i-line)
- DevelopmentAR 300-44, 4 min Puddle