AR-N 4400 series (CAR 44)
(AR-N 4400-05, AR-N 4400-10, AR-N 4400-25, AR-N 4400-50)
Thick and very thick negative resists for electroplating, microsystem technology and LIGA < 20 μm - > 50 μm
AR-N 4400 series (CAR 44)
Characterisation
- i-, g-line, e-beam, broadband UV
- chemically enhanced, very good adhesion, electro plating-stable
- very high sensitivity, easy removal
- profiles with high edge steepness for excellent resolution
- covering of topologies
- 4400-05 for layer thicknesses up to 10 μm (250 rpm)
- 4400-10 for layer thicknesses up to 20 um (250 rpm)
- 4450-10T for film thicknesses up to 20 μm and lift-off
- 4400-25 for high film thicknesses up to 50 μm (250 rpm)
- 4400-50 for highest film thicknesses up to 100 μm
- novolac, crosslinking agent, amine-based acid generator
- safer solvent PGMEA
Properties
AR-N 4400-05
- Layer thickness/1,000 rpm: 5 µm
- Resolution: 1.0 µm
- Contrast: 4.0
- Flash point: 46 °C
- Storage up to 6 months: 10-18 °C
AR-N 4400-10
AR-N 4400-25
AR-N 4400-50
* The products have a guaranteed shelf life of 6 months from the date of sale when stored according to instructions and can be used beyond this without guarantee until the label date.
Available order sizes
- 1 x 100 ml (experimental sample)
- 1 x 250 ml
- 1 x 1 L
- 6 x 1 L
Please contact us for further requests.
Suitable process chemicals
Structure resolution
AR-N 4400-10: 3 μm resolution at a film thickness of 15 μm
AR-N 4400-25: 5 µm trenches with a layer thickness of 40 µm
Spin curve
Spin curve for AR-N 4400-05 and AR-N 4400-10 (AR-N 4450-10/AR-N 4450-10T)
Spin curve of the AR-N 4400-25 and AR-N 4400-50
Resist structures
Turbine wheel from the AR-N 4400-10
Siemens star with the AR-N 4400-25 (30 µm thick)
Thermal stability and shrinking up to 300 °C
Developed lines with a width of 10 – 20 μm were hardened by flood exposure and subsequent bake step. These lines were tempered stepwise until 300 °C. Up to a temperature of 200 °C, structures remain more or less unchanged
Process parameters
- ResistAR-N 4400-10
- SubstrateSi 4“ Wafer
- Tempering95 °C, 10 min, hot plate
- ExposureMaskaligner MJB 3, Kontaktbelichtung
- DevelopmentAR 300-47, pur, 3 min, 22 °C
Sensitivity
The sensitivity increases constantly with increasing bake temperatures (broadband UV Maskeliner, thickness 5.0 μm)
Resolution
At a film thickness of 5 μm, 1.0 μm bars were produced
Gradation curve
The gradation (contrast) is 3.5, the sensitivity was determined to 21.5 mJ/cm2 for a structure buildup of 90 % (H090)