Developed lines with a width of 10 – 20 μm were hardened by flood exposure and subsequent bake step. These lines were tempered stepwise until 300 °C. Up to a temperature of 200 °C, structures remain more or less unchanged.
3 μm resolution at a film thickness of 15 μm
Si 4“ Wafer
95 °C, 10 min, hot plate
Maskaligner MJB 3, Kontaktbelichtung
AR 300-47, pur, 3 min, 22 °C
Since 1992, we provide our customers with high quality products at moderate prices. Due to an efficient research department and our “close ear“ to the customer, we quickly respond to the needs of the market and consistently offer product innovations.