Undercuts produced with low exposure dose (AR-N 4450-10T)
3 μm resolution at a film thickness of 15 μm
Si 4“ Wafer
95 °C, 10 min, hot plate
Maskaligner MJB 3, Kontaktbelichtung
AR 300-47, pur, 3 min, 22 °C
Since 1992, we provide our customers with high quality products at moderate prices. Due to an efficient research department and our “close ear“ to the customer, we quickly respond to the needs of the market and consistently offer product innovations.