profiles with high edge steepness dimens. accuracy
plasma etch resistant, electroplating-stable
transparent for thick films up to 100 μm in multiple coating steps, 100 μm development in one step
combination of novolac and naphthoquinone diazide
Safer Solvent PGMEA
Interesting Resist Wiki articles
Film thickness/ 4000 rpm (μm)
Flash point (°C)
Storage 6 month (°C)
Available order sizes
Product on request
Please contact us for further requests.
Suitable process chemicals
Film thickness 12 μm Resist structures 4 μm
Si 4“ Wafer
95 °C, 10-15 min, hot plate
Maskaligner MJB 3, Kontaktbelichtung
AR 300-26, 1 : 3, 3 min, 22 °C
Since 1992, we provide our customers with high quality products at moderate prices. Due to an efficient research department and our “close ear“ to the customer, we quickly respond to the needs of the market and consistently offer product innovations.
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