Thinner AR 300-12

For adjusting the film thickness of photoresists and e-beam resists

Product information

Your request for this product

Characterisation

ultra-filtered, colourless, high-purity organic solvent mixtures
adjustment of resist film thickness by defined dilution
edge bead removal of coated substrates as well as cleaning of equipment
removal of photoresist films tempered at up to 150 °C and of non-tempered e-beam resist films

Interesting Resist Wiki articles

29. September 2016

Evaluation of various developers for e-beam exposed CSAR 62 layers (100 kV)

4. July 2016

Interference lithography

15. August 2012

Thinner

30. July 2012

Process procedure photoresist

Properties

Main component
PGMEA
Flash point (°C)
42°C
Water content max. (%)
0,1%
Non-volatiles max. (%)
0,002%

Available order sizes

1 x 250 ml ((experimental sample)
1 x 1.000 ml
1 x 2.500 ml
4 x 2.500 ml
8 x 2.500 ml

Please contact us for further requests.

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