Thinner AR 300-12
For adjusting the film thickness of photoresists and e-beam resists
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Characterisation
- ultra-filtered, colourless, high-purity organic solvent mixtures
- adjustment of resist film thickness by defined dilution
- edge bead removal of coated substrates as well as cleaning of equipment
- removal of photoresist films tempered at up to 150 °C and of non-tempered e-beam resist films
Suitable products
Adhesion Promoter AR 300-80 new
For improving the adhesive strength of photo and e-beam resists
Bottom Resist AR-BR 5460
Positive or negative system for optically transparent and thermally resistant structures
Bottom Resist AR-BR 5480
Positive or negative system for optically transparent and thermally resistant structures
Developer AR 300-26
For the development of photoresists and novolac-based e-beam resist films
Developer AR 300-35
For the development of photoresists and novolac-based e-beam resist films
Developer AR 300-44
For the development of photoresists and novolac-based e-beam resist films
Developer AR 300-46
For the development of photoresists and novolac-based e-beam resist films
Developer AR 300-47
For the development of photoresists and novolac-based e-beam resist films
Developer AR 300-475
For the development of photoresists and novolac-based e-beam resist films
Developer AR 600-50
For the development of e-beam resists films
Developer AR 600-51
For the development of e-beam resists films
Developer AR 600-546
For the development of e-beam resists films
Developer AR 600-548
For the development of e-beam resists films
Developer AR 600-549
For the development of e-beam resists films
Developer AR 600-55
For the development of e-beam resists films
Developer AR 600-56
For the development of e-beam resists films
E-Beam Resist AR-N 7500 series
High resolution, process-stable (no CAR) resist for mix & match-processes, temperature stable up to 120 °C
E-Beam Resist AR-N 7520 new series
Highest resolution and highly sensitive resist for mix & match, thermostable up to 140 °C
E-Beam Resist AR-N 7520 series
High resolution resist for mix & match-processes, for high-precision edges, thermo-stable up to 140 °C
E-Beam Resist AR-N 7700 series
High-resolution e-beam resists for the production of integrated circuits
E-Beam Resist AR-N 7720 series
AR-N 7720 e-beam resists with flat gradation High-resolution e-beam resists for the production of diffractive optics
E-Beam Resist AR-N 8200 series (Medusa 82)
Experimental sample/custom-made product
E-Beam Resist AR-N 8250 series (Medusa 82)
Experimental sample/custom-made product
E-Beam Resist AR-P 617 series
Resists for nanometer lithography, highest resolution, Copolymer 33% MA, Solvent: methoxypropanol
E-Beam Resist AR-P 6200 series (CSAR 62)
High-contrast e-beam resists for the production of integrated circuits and masks
E-Beam Resist AR-P 631 series
PMMA resist series 50K – 950K for the production of integrated circuits and masks
E-Beam Resist AR-P 632 series
PMMA resist series 50K – 950K for the production of integrated circuits and masks
E-Beam Resist AR-P 639 series
PMMA resist series 50K – 950K for the production of integrated circuits and masks
E-Beam Resist AR-P 641 series
PMMA resist series 50K – 950K for the production of integrated circuits and masks
E-Beam Resist AR-P 642 series
PMMA resist series 50K – 950K for the production of integrated circuits and masks
E-Beam Resist AR-P 649 series
PMMA resist series 50K – 950K for the production of integrated circuits and masks
E-Beam Resist AR-P 6510 series
Thick positive resists for the production of microcomponents
E-Beam Resist AR-P 661 series
PMMA resist series 50K – 950K for the production of integrated circuits and masks
E-Beam Resist AR-P 662 series
PMMA resist series 50K – 950K for the production of integrated circuits and masks
E-Beam Resist AR-P 669 series
PMMA resist series 50K – 950K for the production of integrated circuits and masks
E-Beam Resist AR-P 671 series
PMMA resist series 50K – 950K for the production of integrated circuits and masks
E-Beam Resist AR-P 672 series
PMMA resist series 50K – 950K for the production of integrated circuits and masks
E-Beam Resist AR-P 679 series
PMMA resist series 50K – 950K for the production of integrated circuits and masks
E-Beam Resist AR-P 7400 series
Plasma etching resistant e-beam resists for the production of integrated circuits and masks
E-Beam Resist AR-P 8100 series (Phoenix 81)
High-contrast, thermolabile resist for integrated circuits and holographic structures
HMDS adhesion promoter
For improving the adhesive strength of photo and e-beam resists
Photoresist AR-N 2210
Ready-to-use positive and negative spray resists for various applications
Photoresist AR-N 2220
Ready-to-use positive and negative spray resists for various applications
Photoresist AR-N 2230
Ready-to-use positive and negative spray resists for various applications
Photoresist AR-N 4340
Highly sensitive negative resist for the production of integrated circuits
Photoresist AR-N 4400-05 (CAR 44)
Thick negative resists for electroplating, microsystems technology and LIGA ≤ 20 μm
Photoresist AR-N 4400-10 (CAR 44)
Thick negative resists for electroplating, microsystems technology and LIGA ≤ 20 μm
Photoresist AR-N 4400-25 (CAR 44)
Thick negative resists for electroplating, microsystems technology and LIGA ≥ 50 μm
Photoresist AR-N 4400-50 (CAR 44)
Thick negative resists for electroplating, microsystems technology and LIGA ≥ 50 μm
Photoresist AR-N 4450-10 T (CAR 44)
Thick negative resists for electroplating, microsystems technology and LIGA ≥ 50 μm
Photoresist AR-N 4600 series (Atlas 46)
Thick negative resists for electroplating, microsystems technologies and LIGA < 20 μm
Photoresist AR-P 1210
Ready-to-use positive and negative spray resists for various applications
Photoresist AR-P 1220
Ready-to-use positive and negative spray resists for various applications
Photoresist AR-P 1230
Ready-to-use positive and negative spray resists for various applications
Photoresist AR-P 3110
Adhesion-enhanced positive resists for the production of masks and fine scale divisions
Photoresist AR-P 3120
Adhesion-enhanced positive resists for the production of masks and fine scale divisions
Photoresist AR-P 3170
Adhesion-enhanced positive resists for the production of masks and fine scale divisions
Photoresist AR-P 3210
Thick positive resists for electroplating and microsystems technology
Photoresist AR-P 3220
Thick positive resists for electroplating and microsystems technology
Photoresist AR-P 3250
Thick positive resists for electroplating and microsystems technology
Photoresist AR-P 3510
Sensitive positive-tone standard resists for the production of integrated circuits
Photoresist AR-P 3510 T
Sensitive positive-tone standard resists for the production of integrated circuits
Photoresist AR-P 3540
Sensitive positive-tone standard resists for the production of integrated circuits
Photoresist AR-P 3540 T
Sensitive positive-tone standard resists for the production of integrated circuits
Photoresist AR-P 3740
Sensitive positive-tone standard resists for the production of highly integrated circuits
Photoresist AR-P 3840
Sensitive positive-tone standard resists for the production of highly integrated circuits
Photoresist AR-P 5320
Sensitive positive-tone resists for the production of evaporation samples
Photoresist AR-P 5350
Sensitive positive-tone resists for the production of evaporation samples
Photoresist AR-P 5910
Adhesion-enhanced positive-tone resist for complicated patternings with HF etching mixtures
Photoresist AR-U 4030
Image reversal resist for the fabrication of integrated circuits
Photoresist AR-U 4040
Image reversal resist for the fabrication of integrated circuits
Photoresist AR-U 4060
Image reversal resist for the fabrication of integrated circuits
Photoresist SX AR-P 3500/8
Positive photoresist for high-temperature application up to 300 °C
Photoresist X AR-P 3220/7
Thick temperature-stable positive photoresist Experimental sample/custom-made product
Photoresist X AR-P 5900/4
Experimental sample/custom-made product
Protective Coating AR-PC 503
Wafer backside protection during front side etchings for the production of deep structures in silicon
Protective Coating AR-PC 5040
Wafer backside protection during front side etchings for the production of deep structures in silicon
Protective Coating AR-PC 5090.02 (Electra 92)
Conductive protective coating for non-novolak-based e-beam resists Top layer for the dissipation of e-beam charges on insulating substrates
Protective Coating AR-PC 5091.02 (Electra 92)
Top layer for the dissipation of e-beam charges on insulating substrates
Protective Coating SX AR-PC 5000/41
KOH and HF resistant protective coating for wafer backside protection
Protective Coatings AR-PC 504
Wafer backside protection during front side etchings for the production of deep structures in silicon
Remover AR 300-70
For the stripping of tempered photoresist and e-beam resist films
Remover AR 300-72
For the stripping of tempered photoresist and e-beam resist films
Remover AR 300-73
For the stripping of tempered photoresist and e-beam resist films
Remover AR 300-76
For the stripping of tempered photoresist and e-beam resist films
Remover AR 600-70
For the stripping of tempered photoresist and e-beam resist films
Remover AR 600-71
For the stripping of tempered photoresist and e-beam resist films
Stopper AR 600-60
For the stopping of e-beam resist film development with solvents
Thinner AR 300-12
For adjusting the film thickness of photoresists and e-beam resists
Thinner AR 600-02
For adjusting the film thickness of photoresists and e-beam resists
Thinner AR 600-07
For adjusting the film thickness of photoresists and e-beam resists
Thinner AR 600-09
For adjusting the film thickness of photoresists and e-beam resists
Quality Promise
Since 1992, we provide our customers with high quality products at moderate prices. Due to an efficient research department and our “close ear“ to the customer, we quickly respond to the needs of the market and consistently offer product innovations.
AR NEWS
Contact
Allresist GmbH
Am Biotop 14
15344 Strausberg
Germany
Tel: +49 3341 – 35 93 0
Fax: +49 3341 – 35 93 29
E-Mail: info(a)allresist.de