You are here: / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / Thinner AR 300-12

Thinner AR 300-12

For adjusting the film thickness of photoresists and e-beam resists

Characterisation

  • ultra-filtered, colourless, high-purity organic solvent mixtures
  • adjustment of resist film thickness by defined dilution
  • edge bead removal of coated substrates as well as cleaning of equipment
  • removal of photoresist films tempered at up to 150 °C and of non-tempered e-beam resist films

Interesting Resist Wiki articles

Properties

  • Main component
    PGMEA
  • Flash point (°C)
    42°C
  • Water content max. (%)
    0,1%
  • Non-volatiles max. (%)
    0,002%

Available order sizes

  • 1 x 2.5 L
  • 4 x 2.5 L
  • 8 x 2.5 L

Please contact us for further requests.

Suitable products

E-Beam Resist AR-N 7520 new series

Highest resolution and highly sensitive resist for mix & match, thermostable up to 140 °C

E-Beam Resist AR-N 7520 series

High resolution resist for mix & match-processes, for high-precision edges, thermo-stable up to 140 °C

E-Beam Resist AR-P 6510 series

Thick positive resists for the production of microcomponents

Photoresist AR-N 4340 (CAR)

Highly sensitive negative resist for the production of integrated circuits

Photoresist AR-N 4400 series

Thick and very thick negative resists for electroplating, microsystem technology and LIGA

Photoresist AR-N 4600 series (Atlas 46)

Thick negative resists for electroplating, microsystems technologies and LIGA < 20 μm

Photoresist AR-P 3100 series

Adhesion-enhanced positive resists for the production of masks and fine scale divisions

Photoresist AR-P 3200 series

Thick positive resists for electroplating and microsystems technology

Photoresist AR-P 3500 (T) series

Sensitive positive-tone standard resists for the production of integrated circuits

Photoresist AR-P 3740

Sensitive positive-tone standard resists for the production of highly integrated circuits

Photoresist AR-P 5300 series

Sensitive resists for the production of vapour deposition patterns by lift-off

Photoresist SX AR-N 4340/7

Negative photoresist for one- and two-layer systems, thermostable up to 300 °C

Photoresist SX AR-P 3500/8

Positive photoresist for high-temperature application up to 300 °C

Protective Coating AR-PC 5040

Wafer backside protection during front side etchings for the production of deep structures in silicon

    Product Request

    *Name

    *Company/Institute

    *E-Mail

    *Subject

    *Your Message