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Thinner AR 600-02

For adjusting the film thickness of photoresists and e-beam resists

Characterisation

  • ultra-filtered, colourless, high-purity organic solvent mixtures
  • adjustment of resist film thickness by defined dilution
  • Redge bead removal of coated substrates as well as cleaning of equipment

Interesting Resist Wiki articles

Properties

  • Main component
    Anisol
  • Flash point (°C)
    44°C
  • Water content max. (%)
    0,1%
  • Filtration (μm)
    0,2
  • Non-volatiles max. (%)
    Enter your description here

Available order sizes

  • 1 x 1 L

Please contact us for further requests.

Suitable Products

E-Beam Resist AR-P 6200 series (CSAR 62)

High-contrast e-beam resists for the production of integrated circuits and masks

E-Beam Resist AR-P 632 series

PMMA resist series 50K – 950K for the production of integrated circuits and masks

E-Beam Resist AR-P 642 series

PMMA resist series 50K – 950K for the production of integrated circuits and masks

E-Beam Resist AR-P 662 series

PMMA resist series 50K – 950K for the production of integrated circuits and masks

E-Beam Resist AR-P 672 series

PMMA resist series 50K – 950K for the production of integrated circuits and masks

E-Beam Resist AR-P 8100 series (Phoenix 81)

High-contrast, thermolabile resist for integrated circuits and holographic structures

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