Resist of the month July 2013:
Thermally stable two-layer system – SX AR-N 4340/10 – AR-P 5460

In a large variety of lift-off applications, the resist layer is exposed to high thermal loads. In particular during sputtering processes without additional cooling, temperatures of more than 150 °C may occur. Positive-tone resists based on novolacs begin to melt at these temperatures and render thus a subsequent lift-off process impossible.

Allresist developed for this reason a series of temperature-stable negative photoresists. One of the first samples, the SX AR-N 4340/10, was assessed in the CTR Research Center for Intelligent Sensors with respect to its resistance to higher temperatures.

Process procedure: In a first step, the non-light-sensitive bottom resist AR-P 5460 is applied and tempered at 150 °C. Subsequently, the new negative-tone photoresist SX AR-N 4340/10 is spun onto the bottom resist and dried at 85 °C. After UV-exposure and development with AR 300-44, the desired undercut is obtained. The resist structure was then again tempered at 200 °C.

The undercut was fully preserved in this process (see image 1). This resist is consequently predestined for high-temperature applications. Further investigations with respect to even higher temperature loads are currently in progress. These highly interesting results prompted us to those our new development of a thermally stable negative resist as resist of the month

[Bild] „Twolayer_Temperature“

Image 1 Lift-off structure of the SX AR-N 4340/10 – AR-P 5460 system tempered at 200 °C.

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