As an alternative to the positive polyimide resist (SX AR-PC 5000/82.7), which already contains polyimide as solvent and thus requires no curing at 350-400°C (see „Positive polyimide resist“), a negative resist was developed. This resist of course also allows the generation of highly temperature-resistant structures.
The developer is in this case not aqueous-alkaline, but composed of MIBK. Polyimide negative resists are recommended for users who process moisture-sensitive substrates. The negative resist can also be structured with e-beam lithography.