HMDS adhesion promoter
For improving the adhesive strength of photo and e-beam resists
Please contact us for further requests.
Characterisation
• improvement of the adhesive strength of photo and
e-beam resist films
• especially for surfaces with low adhesion properties,
e.g. metal, SiO2, GaAs
• AR 300-80 new: spin coating of a silicium organic
solution = improved adhesion properties and simple,
cheaper alternative to HDMS
• HMDS: evaporation of HMDS on the substrate
surface (equipment required)
Interesting Resist Wiki articles
Properties
- Density at 20 °C (g/cm3)0,774 g/cm³
- Flash point (°C)14 °C
- Filtration (μm)0,2 µm
- Storage 6 month (°C)10-22 °C
Available order sizes
- 1 x 2.5 L
- 4 x 2.5 L
- 8 x 2.5 L
Processing information HMDS
Appropriate equipment is required for the processing of HMDS. For large scale production, hot plates with HMDS
vapor deposition are used. If no such equipment is available, the following procedure should be applied:
The pre-treatment should be performed immediately prior to resist coating. Generally, hot plates with integrated
HMDS-evaporation are used in the production. If this option is not available, the substrate is placed in a desiccator
where HMDS evaporates at room temperature or at temperatures up to 160 °C max. HMDS is under these conditions
deposited as monomolecular layer (approx. 5 nm) on the substrate surface.
The treated substrate can be coated with resist immediately after HMDS-deposition without subsequent tempering,
or stored in a closed container for a couple of days.
The storage stability may be limited due to an uptake of water from the atmosphere. Storage in open containers
should thus be avoided.
Suitable process chemicals