Adhesive agents serve to improve adhesion, e.g. the adhesion promoter AR 300-80, which is applied by spin coating as thin layer of approximately 15 nm immediately before the resist coating. It is also possible to evaporate HMDS on the substrate, in this process, the monomolecular coat on the wafer surface improves adhesion, because it becomes hydrophobic and better attaches to the resist. Spin coating of HMDS onto the wafer is not recommended, since too little remains on the wafer surface, besides, the spin coater gets impure. See Resist-Wiki “Other resist components)”.
Overview Photoresists- Positive