AR-P 5300 series
(AR-P 5320, AR-P 5350)
Sensitive resists for the production of vapour deposition patterns by lift-off
Please contact us for further requests.
Characterisation
- broadband UV, i-line, g-line
- high photosensitivity, high resolution
- good adhesion properties
- for undercut structures for the production of evaporation samples, in particular of metal using lift-off techniques e.g. for conductor paths
- plasma etching resistant, temperature stable up to 120 °C
- combination of novolac and naphthoquinone diazide
- safer solvent PGMEA
Interesting Resist Wiki articles
Properties
AR-P 5320 (Product on request)
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Layer thickness/4.000 rpm: 5.0 µm
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Resolution: 2.0 µm
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Contrast: 4.0
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Flash point: 44 °C
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Storage: 10-18 °C
AR-P 5350
* The products have a guaranteed shelf life of 6 months from the date of sale when stored according to instructions and can be used beyond this without guarantee until the label date.
Available order sizes (AR-P 5320 on request)
- 1 x 100 ml (test sample)
- 1 x 250 ml
- 1 x 1.000 ml
- 6 x 1.000 ml
Suitable process chemicals
Resist structures
AR-P 5320: Lift-off resist structure after development.
AR-P 5350: Lift-off resist structure after metal vapour deposition
Process parameters
- SubstrateSi 4“ Wafer
- Tempering105 °C, 4 min, hot plate
- Exposureg-line stepper (NA: 0,56)
- DevelopmentAR 300-35, 1 : 2, 60 s, 22 °C
Spin curve
Spin curve of the AR-P 5320 and AR-P 5350.